Cirrus-logic CS8421 Manual do Utilizador descarregar pdf (Página 33)

DS641F6 33

CS8421CS8421

6. PACKAGE DIMENSIONS

Notes:

1. “D” and “E1” are reference datums and do not included mold flash or protrusions, but do include mold mismatch

and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per side.

2. Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be 0.13 mm total in

excess of “b” dimension at maximum material condition. Dambar intrusion shall not reduce dimension “b” by more

than 0.07 mm at least material condition.

3. These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.

TSSOP THERMAL CHARACTERISTICS

INCHES MILLIMETERS

NOTE

DIM MIN NOM MAX MIN NOM MAX

A -- -- 0.043 -- -- 1.10

A1 0.002 0.004 0.006 0.05 -- 0.15

A2 0.03346 0.0354 0.037 0.85 0.90 0.95

b 0.00748 0.0096 0.012 0.19 0.245 0.30 2,3

D 0.252 0.256 0.259 6.40 6.50 6.60 1

E 0.248 0.2519 0.256 6.30 6.40 6.50

E1 0.169 0.1732 0.177 4.30 4.40 4.50 1

e -- -- 0.026 -- -- 0.65

L 0.020 0.024 0.028 0.50 0.60 0.70

0° 4° 8° 0° 4° 8°

JEDEC #: MO-153

Controlling Dimension is Millimeters.

Parameter Symbol Min Typ Max Units

Junction to Ambient Thermal Impedance 2 Layer Board

4 Layer Board



°C/Watt

20L TSSOP (4.4 MM BODY) PACKAGE DRAWING

SEATING

PLANE

SIDE VIEW

END VIEW

TOP VIEW

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Cirrus-logic CS8421 Manual do Utilizador Página 33